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Hardware & embedded

Hardware & Embedded Engineering

Physical products fail in ways software does not. Thermal envelopes, part availability, certification, and field-replaceability constrain the design long before anyone writes firmware. We work across electronics, firmware, and cloud so those constraints are designed around rather than discovered late.

What we are usually hired for

The problems behind the brief.

01

Reference designs that do not survive production

An evaluation board proves the idea. Production requires supply-chain resilience, thermal design, enclosure fit, and a part that will still be available in two years. We design for the second year, not the demo.

02

Firmware and cloud drifting apart

The device and the backend evolve on different schedules, so fielded hardware falls out of protocol compatibility. We version the contract and treat it as an interface.

03

Data you cannot trust

Sensor noise, calibration drift, and intermittent connectivity corrupt datasets downstream. We fix acquisition, buffering, and time synchronisation at the source.

04

Certification treated as an afterthought

Regulatory and radio requirements shape the antenna, layout, and firmware update path. Surfacing them early is cheaper than redesigning around them later.

Core capabilities

What we do, concretely.

Embedded systems and firmware
IoT devices and connected products
Sensor integration and data acquisition
Hardware prototyping and proof of concept
Hardware-software integration
Edge computing and device connectivity

How we approach it

Our method, applied here.

We design against the real operating envelope — temperature, power budget, connectivity, and part lifecycle — because those are the constraints that determine whether the build succeeds. Prototype early, on the parts you intend to ship.

  1. Discover

    constraints / users / success criteria

  2. Design

    architecture / plan / risk register

  3. Build

    integration / CI / review

  4. Deploy

    monitoring / runbooks / handover

Architecture

Layered view of a hardware & embedded engagement — interface, integration, infrastructure, operations.

  1. Interface

    • Embedded systems and firmware
    • IoT devices and connected products
    • Sensor integration and data acquisition
  2. Integration

    • Schematic capture and PCB layout
    • Embedded C/C++ and Rust
    • RTOS scheduling and resource budgeting
  3. Infrastructure

    • Low-power design
    • Radio and connectivity
    • Sensor fusion and calibration
  4. Operations

    • Monitoring
    • Runbooks
    • Handover

What you receive

Deliverables, not status updates.

Schematics, PCB layout, and a bill of materials with justified part choices

Firmware with a documented test strategy and over-the-air update path

Prototype hardware assembled and verified against the measured environment

A device-to-cloud protocol with explicit versioning

A test plan covering thermal, power, connectivity, and field-recovery cases

A manufacturing-readiness review and handover package

Disciplines

The skills we bring to the problem.

Schematic capture and PCB layout
Embedded C/C++ and Rust
RTOS scheduling and resource budgeting
Low-power design
Radio and connectivity
Sensor fusion and calibration
DFM and supply-chain planning
Hardware-software interface design

When this applies

Where this capability is the answer.

Taking a bench prototype to a manufacturable revision

Custom sensing hardware for an environment off-the-shelf parts cannot survive

Retrofitting fleet or facility equipment with connected instrumentation

Diagnosing field reliability failures in deployed devices

Ready to scope this properly?

Tell us what you are trying to build and where it is stuck. We will come back with a technical read on the problem and a realistic path through it.

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